Antec Formula X thermal paste The formula syringe design makes it easy to control usage. It can also save some unused paste and use the scraper that comes with it. It can be easily applied by gentle pressure. The stable composition does not contain any metal particles. Non-catheter is not easy to crack or dry; high durability, strong adhesion, formulated with a combination of high thermal conductivity and low thermal resistance, formula x nano diamond particles fully shorten the gap between the cpu and the heat sink, micro-distance, even in the case of overclocking, can play 100 percent. The performance to achieve the best thermal conductivity. The first floor of donggang can achieve high heat dissipation.
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|Item Weight||4.03 Kg|
|Package Dimensions||33.4 x 19 x 11.8 cm|
|Item model number||Formula X|
|Included Components||Thermal Paste|