Out Of Stock
Asus Rog Strix X570-F Gaming Motherboard
- Stock: Out Of Stock
- Model: ROG-STRIX-X570-F-GAMING
- Weight: 3.00kg
- SKU: TLG-001735
- EAN: 4718017378956
Rs.24,520.00
Ex Tax: Rs.20,779.66
Asus Rog Strix X570-F Gaming Motherboard
ROG Strix X570-F Gaming
ROG Strix X570-F Gaming | Motherboards | ASUS India
- AM4 socket: Ready for 2nd and 3rd Gen AMD Ryzen™ processors to maximize connectivity and speed with up to two M.2 Drives, USB 3.2 Gen2 and AMD StoreMI
- Aura Sync RGB: ASUS-exclusive Aura Sync RGB lighting, including RGB headers and addressable Gen 2 GRB headers
- Optimal Power Solution: 12+2 power stages with ProCool II power connector, alloy chokes and durable capacitors to support multi-core processors
- Comprehensive cooling: Active chipset heatsink, MOS heatsink with 8mm heatpipe, dual on-board M.2 heatsinks and a water pump + header
- Gaming connectivity: Supports PCIe 4.0, HDMI 2.0, DisplayPort 1.2 and features dual M.2 and USB 3.2 Type-A and Type-C connectors
- Gaming networking: Intel Gigabit Ethernet, ASUS LANGuard and GameFirst
- 5-Way Optimization: Automated system-wide tuning, providing overclocking and cooling profiles that are tailor made for your rig
- Gaming audio: High fidelity audio with SupremeFX S1220A, DTS® Sound Unbound and Sonic Studio III to draw you deeper into the action
- Easy DIY: ROG-patented pre-mounted I/O shield, ASUS SafeSlot, ASUS Node connector and BIOS Flashback™ for a friendlier building experience
ASUS Corporate Stable Model
ASUS Corporate Stable Model (CSM) is a commercial program designed to provide stable and reliable motherboards. Offering up to 36-month product lifecycle support and 6-month end-of-life notice to allow sufficient lead times for your organization to get ready for product transitions. Each purchase of an ASUS CSM motherboard comes with ASUS Control Center Express - server-grade IT management software.
ASUS Control Center Express
ASUS Control Center Express is centralized server-grade management software that takes just one minute to install and is designed to reduce IT operations costs and improve efficiency. This powerful tool enables IT administrators to manage and control multiple clients in different locations remotely and includes features such as asset management, software deployment and monitoring. It also lets IT staff visualize deployments, facilitating real-time control.
Power delivery enhancements
The 3rd Gen AMD Ryzen™ processors boast more cores and bandwidth, demanding more power than typical desktop CPUs. Prime X570-P is geared up for the demands of these high-core-count processors, offering a stable power to ensure optimal performance.
1.ProCool connectors : It augments the motherboard's link to the PSU with 8+4 pin connectors that pass 12V power directly to the processors. Based on our ProCool design, these jacks use solid pins that can handle more current than hollow-pin connectors.
2.DrMOS Power stages : The CPU VRM on Prime X570-Pro employs a 12+2 power stage design with DrMOS, combining high-side and low-side MOSFETs and drivers into a single package, delivering the power and efficiency that high core count processors demand.
3.Alloy chokes : The Prime X570 series uses efficient alloy chokes and high-quality thermal pads to help transfer heat from the VRM array to a sink with ample surface area for the processors.
4.Durable capacitors : Durable capacitors are engineered to resist extreme temperatures and provide up to 110% better performance than the industry standard. 5.6-layer PCB design : Multiple PCB layers shift heat away from critical components, providing more headroom to push your CPUs beyond stock speeds.
2.DrMOS Power stages : The CPU VRM on Prime X570-Pro employs a 12+2 power stage design with DrMOS, combining high-side and low-side MOSFETs and drivers into a single package, delivering the power and efficiency that high core count processors demand.
3.Alloy chokes : The Prime X570 series uses efficient alloy chokes and high-quality thermal pads to help transfer heat from the VRM array to a sink with ample surface area for the processors.
4.Durable capacitors : Durable capacitors are engineered to resist extreme temperatures and provide up to 110% better performance than the industry standard. 5.6-layer PCB design : Multiple PCB layers shift heat away from critical components, providing more headroom to push your CPUs beyond stock speeds.
Cooler by design
Prime X570-P features the most comprehensive cooling controls ever, configurable via Fan Xpert 4 or the UEFI BIOS.
●Multiple temperature sources Each header can dynamically reference three thermal sensors, and via Fan Xpert 4 you can even map the temperature of supported ASUS graphics cards to optimize cooling for GPU and CPU-intensive tasks.
●AIO pump A dedicated PWM/DC header for self-contained water-cooling setups.
●4-pin PWM/DC fan Each onboard header supports auto-detection of PWM or DC fans.
●AIO pump A dedicated PWM/DC header for self-contained water-cooling setups.
●4-pin PWM/DC fan Each onboard header supports auto-detection of PWM or DC fans.
Active Chipset Heatsink Solution
PCIe 4.0 provides twice the bandwidth for data flowing through the chipset, which creates more heat than the previous generation. The Prime X570-P features an actively cooled heatsink to prevent throttling during sustained transfers.
● Custom Delta Superflo Fan: The custom low-noise fan features a high-durability bearing with a 60,000-hour L10* lifespan. * L10 bearing life is a standard metric that specifies the number of hours that 90% of the bearing are expected to continue successfully operating, as a minimum.
● Air Duct: A specially-designed air duct helps the fan generate static pressure and concentrates air flow over the fins.
● Finned heatsink: The heatsink fin density is optimized to maximize surface area while maintaining a low-resistance exhaust path.
● Air Duct: A specially-designed air duct helps the fan generate static pressure and concentrates air flow over the fins.
● Finned heatsink: The heatsink fin density is optimized to maximize surface area while maintaining a low-resistance exhaust path.
Dual PCIe 4.0 M.2 slots
With PCIe 4.0 M.2 Slot supports up to 22110 and provide NVMe SSD RAID support for an incredible performance boost. Create a RAID configuration with up to two PCIe 4.0 storage devices to enjoy the fastest data-transfer speeds on the 3rd Generation AMD Ryzen platform.
USB 3.2 Gen 2
With backward-compatible USB 3.2 Gen 2 Type-A™, you'll experience ultimate connection flexibility and blazing data-transfer speeds of up to 10Gbps. *The USB ports under the LAN port require a 3rd Gen AMD Ryzen processor for USB 3.2 Gen 2 speeds.
ASUS OptiMem
ASUS OptiMem memory trace layout unleashes the full performance potential of AMD's Infinity Fabric architecture by enabling higher memory frequencies and lower latencies.
Aura Sync RGB headers
A well-tuned enthusiast system deserves a matching aesthetic. ASUS Aura Sync offers full lighting connected via the motherboard's RGB headers, with a variety of functional presets for external LED strips.* And it can all be synced with an ever-growing portfolio of Aura-capable ASUS hardware.
- CPUAMD AM4 Socket 3rd and 2nd AMD Ryzen™/2nd and 1st Gen AMD Ryzen™ with Radeon™ Vega Graphics Processors
* Refer to www.asus.com for CPU support list - ChipsetAMD X570
- Memory3rd Gen AMD Ryzen™ Processors
4 x DIMM, Max. 128GB, DDR4 MHz Un-buffered Memory *
2nd Gen AMD Ryzen™ Processors
4 x DIMM, Max. 128GB, DDR4 MHz Un-buffered Memory *
2nd and 1st Gen AMD Ryzen™ with Radeon™ Vega Graphics Processors
4 x DIMM, Max. 128GB, DDR4 MHz Un-buffered Memory
Dual Channel Memory Architecture
* Refer to www.asus.com for the Memory QVL (Qualified Vendors Lists). - GraphicIntegrated Graphics in the 2nd and 1st Gen AMD Ryzen™ with Radeon™ Vega Graphics Processors
Multi-VGA output support : HDMI/DisplayPort ports
- Supports HDMI 2.0b with maximum resolution of 4096 x 2160 @ 60 Hz
- Supports DisplayPort 1.2 with max. resolution 4096 x 2160 @ 60 Hz - Multi-GPU Support3rd and 2nd Gen AMD Ryzen™ Processors
Supports NVIDIA® 2-Way SLI® Technology 1 year / 2 years
Supports AMD 3-Way CrossFireX™ Technology