ROG STRIX X570-E GAMING
ROG STRIX X570-E GAMING Motherboard| MOTHERBOARDS | ASUS INDIA
- AM4 socket: Ready for 2nd and 3rd Gen AMD Ryzen™ processors to maximize connectivity and speed with up to two M.2 Drives, USB 3.2 Gen2 and AMD StoreMI
- Aura Sync RGB: ASUS-exclusive Aura Sync RGB lighting, including RGB headers and addressable Gen 2 GRB headers
- Optimal Power Solution: 12+4 power stages with ProCool II power connector, alloy chokes and durable capacitors to support multi-core processors
- Comprehensive cooling: Active chipset heatsink, MOS heatsink with 8mm heatpipe, dual on-board M.2 heatsinks and a water pump + header
- Gaming connectivity: Supports PCIe 4.0, HDMI 2.0, DisplayPort 1.2 and features dual M.2 and USB 3.2 Type-A and Type-C connectors
- Gaming networking: 2.5Gbps LAN and Intel Gigabit Ethernet with ASUS LANGuard, Wi-Fi 6 (802.11ax) with MU-MIMO, and gateway teaming via GameFirst V
- 5-Way Optimization: Automated system-wide tuning, providing overclocking and cooling profiles that are tailor made for your rig
- Gaming audio: High fidelity audio with SupremeFX S1220A, DTS® Sound Unbound and Sonic Studio III to draw you deeper into the action
- Easy DIY: ROG-patented pre-mounted I/O shield, ASUS SafeSlot, ASUS Node connector and BIOS Flashback™ for a friendlier building experience
POWER DESIGN
Digital power control and an array of power stages ensures ROG Strix X570-E Gaming has the muscle to control the latest AMD Ryzen CPUs.
COOLING INNOVATION
1. MOS heatsink with 8mm heatpipe : A MOS heatsink provides a large contact area for the MOSFETs and chokes, and a heatpipe enables more efficient cooling of the west and north MOS heatsink for better performance and wattage resistance.
2. Thermal pad : A high-quality thermal pad helps transfer heat from the inductor and phase array to the heatsink.
3. 6-Layer PCB : The 6-layer PCB quickly dissipates heat around the VRM, improving overall system stability and giving the CPU more overclocking headroom.
4. Dual M.2 heatsinks : The M.2 heatsink keeps the M.2 SSD at the optimum operating temperature for consistent performance and reliability.
5. Active chipset heatsink : A chipset heatsink with a dedicated chipset fan ensures optimal cooling for more stable performance.
2. Thermal pad : A high-quality thermal pad helps transfer heat from the inductor and phase array to the heatsink.
3. 6-Layer PCB : The 6-layer PCB quickly dissipates heat around the VRM, improving overall system stability and giving the CPU more overclocking headroom.
4. Dual M.2 heatsinks : The M.2 heatsink keeps the M.2 SSD at the optimum operating temperature for consistent performance and reliability.
5. Active chipset heatsink : A chipset heatsink with a dedicated chipset fan ensures optimal cooling for more stable performance.
ACTIVE CHIPSET HEATSINK SOLUTION
PCIe 4.0 provides twice the bandwidth for data flowing through the chipset, which creates more heat than the previous generation. The ROG Strix X570-E features an actively cooled heatsink to prevent throttling during sustained transfers.
● Custom Delta Superflo Fan : The custom low-noise fan features a high-durability bearing with a 60,000-hour L10* lifespan. * L10 bearing life is a standard metric that specifies the number of hours that 90% of the bearing are expected to continue successfully operating, as a minimum.
● Air Duct : A specially-designed air duct helps the fan generate static pressure and concentrates air flow over the fins.
● Finned heatsink : The heatsink fin density is optimized to maximize surface area while maintaining a low-resistance exhaust path.
● Air Duct : A specially-designed air duct helps the fan generate static pressure and concentrates air flow over the fins.
● Finned heatsink : The heatsink fin density is optimized to maximize surface area while maintaining a low-resistance exhaust path.
DUAL PCIE 4.0 M.2
Dual PCIe 4.0 M.2 slots support up to type 22110 and provide NVMe SSD RAID support for an incredible performance boost. Create a RAID configuration with up to two PCIe 4.0 storage devices to enjoy the fastest data-transfer speeds on the 3rd Gen AMD Ryzen platform.
ASUS OPTIMEM
ASUS OptiMem memory trace layout unleashes the full performance potential of AMD’s Infinity Fabric architecture by enabling higher memory frequencies and lower latencies.
NEXT-GEN CONNECTIVITY
ROG Strix X570-E Gaming amps up networking with 2.5G Ethernet and next-gen Intel® Wi-Fi 6 (802.11ax) that surpasses gigabit speeds to take your LAN to the next level. With ROG GameFirst software that offers multi-gate teaming, you'll enjoy the very best online gaming experience.
1. 2.5G Ethernet
2.5G on-board Ethernet kicks your LAN connection up a notch with an up to 2.5X bandwidth improvement. Using your existing LAN cable, you can take advantage this networking upgrade to experience smoother, lag-free gaming, immediately stream high-resolution videos and enjoy faster file transfers.
2. Intel Gigabit Ethernet
ROG Strix X570-E Gaming features Intel Ethernet (I211-AT), ensuring data exchanges with your network and the outside world are fast and smooth. Intel LAN reduces CPU overhead and increases TCP and UDP throughput, keeping more processing power.
2.5G on-board Ethernet kicks your LAN connection up a notch with an up to 2.5X bandwidth improvement. Using your existing LAN cable, you can take advantage this networking upgrade to experience smoother, lag-free gaming, immediately stream high-resolution videos and enjoy faster file transfers.
2. Intel Gigabit Ethernet
ROG Strix X570-E Gaming features Intel Ethernet (I211-AT), ensuring data exchanges with your network and the outside world are fast and smooth. Intel LAN reduces CPU overhead and increases TCP and UDP throughput, keeping more processing power.