Enermax ETS-T50 AXE aRGB CPU Air Cooler - White 

series is a side-flow CPU air cooler, supporting 230W+ TDP and synchronizing with addressable RGB enabled motherboards. Equipped with patented Air Guide allows users to adjust airflow direction to enhance the system’s cooling performance; the attached high pressure blade fan can generate stronger airflow to cool down the heatsink rapidly. The heatsink is characterized with patented Vortex Generation Flow (VGF) design and Pressure Differential Flow (PDF) design to create dynamic airflow and increase heat dissipation. ETS-T50 AXE ARGB further provides plug & play function to display vivid rainbow RGB lighting effect by simply connecting a PWM power cable.

Specification

Model

Brand

ENERMAX

Series

ETS-T50 ARGB Series

Model

ETS-T50A-W-ARGB

Details

Type

Fan & Heatsinks

Fan Size

120mm

CPU Socket Compatibility

Intel LGA 2066 / 2011-3 / 2011 / 1366 / 1156 / 1155 / 1151 / 1150

AMD AM4 / AM3+ / AM3 / AM2+ / AM2 / FM2+ / FM2 / FM1

Bearing Type

Twister Bearing

RPM

500 - 1600 (+/-10%) RPM

Air Flow

23.81 - 71.32 CFM

Noise Level

14 - 24 dBA

Power Connector

4 pin PWM connector
4-pin ARGB connector (5V/D/-/G)

Color

White

LED

Addressable RGB

Heatsink Material

Copper Heat Pipes / Aluminum Fins

Dimensions & Weight

Max CPU Cooler Height

160 mm

Fan Dimensions

Heatsink Dimensions

 4.70 in x 1.91 in x 3.97 in

Weight

 1.90 lb (w/ fan)

Features

Features

Synchronize RGB lighting via addressable RGB headers (5V/D/-/G) of motherboards from ASUS Aura Sync, GIGABYTE RGB Fusion, MSI Mystic Light Sync and ASRock Polychrome

PWM power cable to connect the fan to create constant rainbow RGB lighting effects, no software or adaptor needed

High pressure blade design is a precision engineering of the blade angle and shape calculation

Patented air guide with rotatable grill for preferred airflow direction

Patented Pressure Differential Flow (PDF) design uses differential wind pressure to increase 15% more airflow

Patented Vortex Generation Flow (VGF) design to increase air convection around the heat pipe

Unique air path creating high Vacuum Effect (VEF) to optimize airflow

Heat-pipe Direct Touch (HDT) technology to ensure rapid thermal conduction and eliminate CPU hot spots

Asymmetric heat pipe design allows extra space for ideal RAM compatibility